UltraFLuGs

Microsystem technology is one of the most important key technologies in the German economy. The construction of microelectronic systems is becoming increasingly complex, placing higher demands on the assembly and sealing technology of the systems. The demand for joining technologies that connect LTCC glass systems reliably and economically, without additional materials and without significant temperature increases, is growing rapidly.
The project aims to develop such a joining technology using ultra-short pulse lasers. The goal is to weld glass and LTCC substrates together in a material-locking manner. The extremely low and locally limited heat input specific to lasers allows long-term stable, dense connections to be achieved. To this end, the beam-material interactions are to be investigated.
The approach of welding opaque glass ceramics with transparent glasses using ultrashort laser pulses represents a completely new approach that has not yet been seen on the market or in research.