Flexible glass cutting through systematic modifications
Glass is a versatile and sustainable material that plays an important role in many high-tech applications in electronics, optics, medical technology, and semiconductor manufacturing. Nevertheless, the precise processing of glass, especially cutting, remains a challenging task. Due to the brittle-hard material properties, cutting processes often result in microcracks, thermal stresses, or insufficient cut quality.
The project aims to further develop glass cutting using ultrashort laser pulses in order to transfer the process to industrial applications for thick-walled glass components. The focus is on developing a simple and cost-effective process technology that ensures high flexibility and machining quality. This will enable companies to integrate UKP laser technology into their production processes and use it efficiently.